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| 1 motorola sensor device data !"$%" %"& $"$ "##%" # " ! $ !"$%" ! #$ "$ motorola's m pxv6115vc6u sensor integrates onc hip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. the small form factor and high reliability of onchip integration make the motorola pressure sensor a logical and economical choice for the system designer. the MPXV6115Vc6u piezoresistive transducer is a stateoftheart, monolithic, signal conditioned, silicon pressure sensor. this sensor combines advanced micromachining tec hniques, thin film metallization, and bipolar semi- conductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. features ? improved accuracy at high temperature ? 1.5% maximum error over 0 to 85 c ? ideally suited for microprocessor or microcontrollerbased systems ? temperature compensated from 40 to +125 c ? durable thermoplastic (pps) surface mount package application examples ? vacuum pump monitoring ? brake booster monitoring figure 1. fully integrated pressure sensor schematic ) & &"& " !"' ) ;@? " ' " ! '!$%'(% #!$"&' #" " " &' " &' " %#(" %%" & ' %( '%, $ "& " % "# #""'& order this document by MPXV6115Vc6u/d semiconductor technical data ? motorola, inc. 2001 5 6 7 8 n/c v s gnd v out n/c n/c n/c integrated pressure sensor 115 to 0 kpa (16.7 to 2.2 psi) 0.2 to 4.6 volts output pin number note: pins 1, 5, 6, 7, and 8 are internal device connections. do not connect to external circuitry or ground. pin 1 is denoted by the notch in the lead. 1 2 3 MPXV6115Vc6u case 482a 4 n/c small outline package rev 0 f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 2 motorola sensor device data maximum ratings (1) parametrics symbol value units maximum pressure (p1 p2) p max 400 kpa storage temperature t stg 40 to +125 c operating temperature t a 40 to +125 c output source current @ full scale output (2) i o + 0.5 madc output sink current @ minimum pressure offset (2) i o 0.5 madc notes: 1. exposure beyond the specified limits may cause permanent damage or degradation to the device. 2. maximum output current is controlled by effective impedance from v out to gnd or v out to v s in the application circuit. operating characteristics (v s = 5.0 vdc, t a = 25 c unless otherwise noted, p1 p2.) characteristic symbol min typ max unit pressure range p op 115 e 0 kpa supply voltage (1) v s 4.75 5.0 5.25 vdc supply current i o e 6.0 10 madc full scale output (2) (0 to 85 c) @ v s = 5.0 volts (p diff = 0 kpa) v fso 4.534 4.6 4.665 vdc full scale span (3) (0 to 85 c) @ v s = 5.0 volts v fss e 4.4 e vdc accuracy (4) (0 to 85 c) e e e 1.5 %v fss sensitivity v/p e 38.26 e mv/kpa response time (5) t r e 1.0 e ms warmup time (6) e e 20 e ms offset stability (7) e e 0.5 e %v fss notes: 1. device is ratiometric within this specified excitation range. 2. full scale output (v fso ) is defined as the output voltage at the maximum or full rated pressure. 3. full scale span (v fss ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a perc ent of span at 25 c due to all sources of error including the following: ? linearity: output deviation from a straight line relationship with pressure over the specified pressure range. ? temperature hysteresis: output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. ? pressure hysteresis: output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25 c. ? tcspan: output deviation over the temperature range of 0 to 85 c, relative to 25 c. ? tcoffset: output deviation with minimum pressure applied, over the temperature range of 0 to 85 c, relative to 25 c. 5. response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when s ubjected to a specified step change in pressure. 6. warmup time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 7. offset stability is the product's output deviation when subjected to 1000 cycles of pulsed pressure, temperature cycling with bias test. f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 3 motorola sensor device data figure 2. cross sectional diagram sop (not to scale) figure 3. typical application circuit (output source current operation) v s $6: ) " $6: ) ;@? $6: ?; : < (#%#& #" #' * % #" %"' &"& " !"' ' %!#$ &' & &' " && &' $ %! $ $ #" figure 2 illustrates the absolute sensing chip in the basic small outline chip carrier (case 482). figure 3 shows a typical application circuit (output source current operation). figure 4. output versus absolute pressure !+ '%"&% ("' #" ) ;@? ) & - $ . $=3>>@=3 3==;= '39< /1?;= ) & ) & ) )21 '!$ ! " ) ;@? a> )((! transfer function MPXV6115Vc6u #('$(')# '& figure 4 shows the sensor output signal relative to pres- sure input. typical minimum and maximum output curves are shown for operation over 0 to 85 c temperature range. the output will saturate outside of the rated pressure range. a fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the s ilicon diaphragm. the MPXV6115Vc6u pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. media other than dry air may have adverse effects on sensor performance and longterm reliability. contact the factory for information regarding me- dia compatibility in your application. f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 4 motorola sensor device data transfer function (MPXV6115Vc6u) nominal transfer value: v out = v s x (0.007652 x p + 0.92) (pressure error x temp. factor x 0.007652 x v s ) v s = 5.0 0.25 vdc temperature error band MPXV6115Vc6u =3/7 $;6:?> " ! ?; '39<3=/?@=3 6: '39<3=/?@=3 ==;= /1?;= note: the temperature multiplier is a linear response from 0 c to 40 c and from 85 c to 125 c pressure error band $=3>>@=3 6: 7$/ 038;b /?9;><53=61 $=3>>@=3 ==;= !/c d d $=3>>@=3==;=7$/ ?; 7$/ 7$/ ==;= 696?> 4;= $=3>>@=3 ordering information e small outline package device type options case no. mpx series order no. packing options marking ported element vacuum, axial port 482a MPXV6115Vc6u rails MPXV6115V f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 5 motorola sensor device data surface mounting information minimum recommended footprint for small outline package surface mount board layout is a critical portion of the total design. the footprint for the semiconductor package must be the correct size to ensure proper solder connection inter- face between the board and the package. with the correct pad geometry, the packages will selfalign when subjected to a solder reflow process. it is always recommended to fabri- cate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. ',$+ ',$+ ',$ figure 5. sop footprint (case 482a) 6:15 99 f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 6 motorola sensor device data small outline package dimensions case 482a01 issue a & & "#'& !"& #" " " '# %" " $% "& , ! #"'%# " !"& #" " !"& #" " # "#' " ( !# $%#'%(& #" !+ !(! !# $%#'%(& #" )%' &(%& ',$ %' s d g 8 pl & ! & ' a b c m j k pin 1 identifier h t n v w f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 7 motorola sensor device data notes f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 8 motorola sensor device data motorola reserves the right to make changes without further notice to any products herein. motorola makes no warranty, represe ntation or guarantee regarding the suitability of its products for any particular purpose, nor does motorola assume any liability arising out of the applicati on or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. atypicalo parameters which may be provided in motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operatin g parameters, including at ypicalso must be validated for each customer application by customer's technical experts. motorola does not convey any license under it s patent rights nor the rights of others. motorola products are not designed, intended, or authorized for use as components in systems intended for surgical imp lant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the motorola product could create a s ituation where personal injury or death may occur. should buyer purchase or use motorola products for any such unintended or unauthorized application, buyer shall indemnify and hold motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expens es, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized u se, even if such claim alleges that motorola was negligent regarding the design or manufacture of the part. motorola, inc. motorola, inc. is an equal opportunity/a ffirmative action employer. motorola and the logo are registered in the us patent & trademark office. all other product or service names are the property of t heir respective owners. motorola, inc. 2001. how to reach us: usa/europe/locations not listed : motorola literature distribution; p.o. box 5405, denver, colorado 80217. 13036752140 or 18004412447 japan : motorola japan ltd.; sps, technical information center, 3201, minamiaz abu. minatoku, tokyo 1068573 japan. 8 1334403569 asia/pacific : motorola semiconductors h.k. ltd.; silicon harbour centre, 2 dai king street, tai po industrial estate, tai po, n.t., hong ko ng. 85226668334 technical information center: 18005216274 home page : http://www.motorola.com/semiconductors/ MPXV6115Vc6u/d ? f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . |
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